Title:
HIGH-FREQUENCY SIGNAL LINE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2014078836
Kind Code:
A
Abstract:
To provide a high-frequency signal line capable of suppressing damage to a dielectric layer while reducing an insertion loss, and a method of manufacturing the same.
In a dielectric element 12, a plurality of dielectric sheets 18a and 18b are stacked. A signal line 20 is formed on the back side of a dielectric layer 18a. A signal line 21 is formed on the front side of a dielectric layer 18b. A reference ground conductor 22 faces the signal line 20 in a z-axis direction. The backside of the dielectric layer 18a and the front side of the dielectric layer 18b face each other. The signal lines 20 and 21 face each other, and are electrically connected to each other.
Inventors:
KATO NOBORU
ISHINO SATOSHI
SASAKI JUN
ISHINO SATOSHI
SASAKI JUN
Application Number:
JP2012225162A
Publication Date:
May 01, 2014
Filing Date:
October 10, 2012
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01P3/08; H01P11/00; H05K1/02
Attorney, Agent or Firm:
Patent business corporation Profic patent office
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