HIGH FREQUENCY TRANSMISSION LINE, ELECTRONIC COMPONENT USING THE SAME AND ELECTRONIC EQUIPMENT

Title:

HIGH FREQUENCY TRANSMISSION LINE, ELECTRONIC COMPONENT USING THE SAME AND ELECTRONIC EQUIPMENT

Document Type and Number:

Japanese Patent JP2003264405

Kind Code:

A

Abstract:

To provide a transmission line with less leakage of an electromagnetic field and to provide electronic components or electronic equipment with satisfactory high frequency characteristics using the transmission line.

The transmission line is realized by digging a groove on a circuit board, forming a conductive film on the surface of the groove, filling the groove with a dielectric, forming a metal conductive body on the dielectric and sandwiching the metal conductive body with the similar one obtained from the groove on which the conductive film is formed and filled with the dielectric from an upper surface.

Inventors:

TORIGOE MAKOTO
SUGA TAKU
KAMISAKA KOICHI

Application Number:

JP2002063431A

Publication Date:

September 19, 2003

Filing Date:

March 08, 2002

Export Citation:

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Assignee:

OPNEXT JAPAN INC

International Classes:

H01P3/02; H01P3/06; H01P3/08; H01P5/08; H01P11/00; H05K1/02; (IPC1-7): H01P3/02

Attorney, Agent or Firm:

Katsuo Ogawa (1 person outside)

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