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Title:
HIGH FREQUENCY VIBRATION INCORPORATED PLASMA DISCHARGE GRINDING DEVICE AND ITS METHOD
Document Type and Number:
Japanese Patent JP2015193074
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a high frequency vibration incorporated plasma discharge grinding device that is superior in surface roughness accuracy for a hard-to-cut material, enables grinding work suitable for shape machining, and improves grinding work accuracy and its efficiency while reforming a machining surface.SOLUTION: A plasma discharge grinding device includes a grinding wheel formed by bonding abrasive particles with electrically-conductive bonding materials, a grindstone spindle and vibration means for making high frequency vibration thereof, and a high frequency pulse power supply for generating plasma. An interval between a workpiece and a rotational grinding wheel is determined by a projection height of the abrasive particles, and the grinding wheel is made to have high frequency vibration to a workpiece surface in an axial direction. Thereby, microbubbles by the cavitation are generated in the water between electrodes where the workpiece comes into contact with the abrasive particles of the grinding wheel, and the relatively large air bubbles generated by the electrolysis of the water are transformed into the microbubbles. A high frequency pulse current is applied between the electrodes to generate plasma, and the workpiece is subjected to etching to generate a reforming layer improved in machinability, and thereby the abrasive particles of the grinding wheel grind.

Inventors:
TACHIBANA TORU
KOBAYASHI SATOSHI
MURAKOSHI CHIKA
KOIKE KAZUNORI
KURIYAGAWA TSUNEMOTO
Application Number:
JP2015060888A
Publication Date:
November 05, 2015
Filing Date:
March 24, 2015
Export Citation:
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Assignee:
MICRON MACHINERY
International Classes:
B23H7/38; B23H5/00; B23H5/04; B23H5/10; B24B1/04; B24B5/06
Domestic Patent References:
JP2014014915A2014-01-30
JP2011176243A2011-09-08
JPS63120062A1988-05-24
JPH07227761A1995-08-29
JP2011176243A2011-09-08
JP2014014915A2014-01-30
JPS63120062A1988-05-24
JPH07227761A1995-08-29
JP2002103207A2002-04-09
JP2016165764A2016-09-15
JP2002103207A2002-04-09
JP2016165764A2016-09-15
Attorney, Agent or Firm:
Patent business corporation Protech
Tetsumu Tetsumu