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Title:
HIGH-FREQUENCY WIRING BOARD AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2004201135
Kind Code:
A
Abstract:

To provide a wiring board, having a filter of superior characteristics, even when using a dielectric of high permittivity, and to provide a manufacturing method for easily manufacturing the wiring board.

Inside a dielectric substrate 1, a space 4a is formed in the signal transmission direction, and a groove 4b is formed on the surface of the dielectric substrate 1. With a strip conductor 6a, formed on one of the internal wall face of the upper wall face and the lower wall face positioned opposite to the space 4a, and with a ground conductor 7a formed on the other internal wall, a microstrip line 8a is formed. Also, with a strip conductor 6b formed on the base of the groove 4b, and a ground conductor 7b formed in such a manner as to cover the groove 4b, a microstrip line 8b is formed.


Inventors:
TERASHI YOSHITAKE
SUZUKI SHINICHI
UCHIMURA HIROSHI
Application Number:
JP2002368844A
Publication Date:
July 15, 2004
Filing Date:
December 19, 2002
Export Citation:
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Assignee:
KYOCERA CORP
International Classes:
H01L23/02; H01P1/203; H01P3/08; H01P11/00; (IPC1-7): H01P3/08; H01L23/02; H01P1/203; H01P11/00
Domestic Patent References:
JPH10107514A1998-04-24
JPH09307320A1997-11-28
JP2002141715A2002-05-17
JPS60134495A1985-07-17
JP2000196235A2000-07-14
JPS6252999A1987-03-07



 
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