Title:
HIGH HEAT RESISTANT AND LOW ODOR GAS ADSORPTION SEALANT FILM
Document Type and Number:
Japanese Patent JP2022155876
Kind Code:
A
Abstract:
To provide a high heat resistant sealant film which adsorbs gas generated from the film itself and gas from a space in contact with the film, has little gas emission, suppresses entrance and exit of gas from/to a package and emission of the gas due to degradation with time, and can resist temperatures from boil to semi-retort sterilization treatment.SOLUTION: A high heat resistant and low odor gas sealant film 1 contains a high heat resistant and low odor resin having heat sealability, and a gas adsorbent 4b, and adsorbs gas generated from the film itself and gas (one or two or more kinds selected from hydrocarbons, aldehydes, ketones and carboxylic acids) from the outside, wherein the high heat resistant and low odor resin has a density of 0.920 g/cm3 or more and 0.960 g/cm3 or less, concentration of total leachable organic carbon (TOC) contained in the film composed of the high heat resistant and low odor resin is 1.5 ppm or more and 250 ppm or less, and the total organic carbon is eluted by boiling treatment at 90-110°C for 30 minutes and stationary storage at 35°C.SELECTED DRAWING: Figure 1
Inventors:
TAKEUCHI NAOYA
SUZUKI YOSHIHIKO
TSUNEDA HIROTAKA
SUZUKI YOSHIHIKO
TSUNEDA HIROTAKA
Application Number:
JP2021059311A
Publication Date:
October 14, 2022
Filing Date:
March 31, 2021
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
B01J20/28; A61L2/04; A61L9/014; B01J20/18; B01J20/20; B01J20/22; B32B27/18; B65D65/40
Attorney, Agent or Firm:
Junji Yuda
Noriyuki Takebayashi
Noriyuki Takebayashi