Title:
感水性ホットメルト接着剤のための高ヒドロキシル化合物
Document Type and Number:
Japanese Patent JP4644770
Kind Code:
B2
Abstract:
A hot melt adhesive composition comprises 5-40 wt.% hydroxyl compounds with a hydroxyl number greater than 100 mg KOH/g and optionally above 40 wt.% polymeric component.
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Inventors:
Charles W. Paul
Michelle Jay Blumental
Michelle Jay Blumental
Application Number:
JP2000111923A
Publication Date:
March 02, 2011
Filing Date:
April 07, 2000
Export Citation:
Assignee:
HENKEL CORPORATION
International Classes:
C09J167/00; C09J201/00; C09J129/08; C09J131/04; C09J167/02
Domestic Patent References:
| JP9118869A | ||||
| JP55038832A | ||||
| JP1126383A |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Jun Tsuruta
Tetsuji Koga
Nagasaka Tomoyasu
Yoshihiro Kobayashi
Kenichi Kato
Akemi Hino
Masaya Nishiyama
Higuchi Souji
Takashi Ishida
Jun Tsuruta
Tetsuji Koga
Nagasaka Tomoyasu
Yoshihiro Kobayashi
Kenichi Kato
Akemi Hino
Masaya Nishiyama
Higuchi Souji