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Patent Searching and Data


Title:
HIGH IMPEDANCE SUBSTRATE
Document Type and Number:
Japanese Patent JP2009027450
Kind Code:
A
Abstract:

To provide a high impedance substrate which has a large ratio band in a low frequency band, and at the same time, is thin enough to be mountable on an electronic device.

The high impedance substrate has: a metal plate (1) as a ground plane; a resonant circuit layer including at least two resonant circuits (2, 3) which are connected through a connection unit (4) with a distance t from the metal plate, and arranged adjacently in the same height with a distance g; and a magnetic material layer (5) arranged between the metal plate and the resonant circuit layer with a distance h from the resonant circuit layer. It is characterized that the distance t between the metal plate and the resonant circuit layer is 0.1 mm or more, and 10 mm or less; the distance g between adjoining resonant circuits in the resonant circuit layer is 0.01 mm or more, and 5 mm or less; and the distance h between the magnetic material layer and the resonant circuit layer is in a range expressed by a formula (1): g/2ht/2.


Inventors:
AIGA FUMIHIKO
SUENAGA SEIICHI
HARADA KOICHI
SUETSUNA TOMOHIRO
YONEZU MAKI
NAKAGAWA NAOYUKI
EGUCHI TOMOKO
Application Number:
JP2007188399A
Publication Date:
February 05, 2009
Filing Date:
July 19, 2007
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
H01Q15/14; H01F1/22; H01F1/33; H01Q17/00
Domestic Patent References:
JP2005538629A2005-12-15
JP2006304271A2006-11-02
JP2004128001A2004-04-22
Foreign References:
WO2008062562A12008-05-29
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto