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Title:
HIGH MOLECULAR THERMOSENSITIVE BODY AND THERMOSENSITIVE DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2001217103
Kind Code:
A
Abstract:

To solve the problem that a high molecular thermosensitive material satisfying all the requirements of electrical characteristics, heat-resistant stability, a thermo-fuse function, moisture resistance or the like has not been obtained for thermosensitive devices which control the temperature of electric warming apparatuses.

Since a polyamide composition in which a polyamide-polyether copolymer, a conductive imparting material and a coupling reinforcement are compounded with the high molecular thermosensitive body is used and the coupling of the conductive imparting material and the polyamide-polyether copolymer is increased by the coupling reinforcement, the high molecular thermosensitive body satisfying moisture-resistant characteristics, electrical characteristics, mechanical strength, heat-resistant stability, the thermo-fuse function and fabricating properties can be obtained, without deteriorating conductive characteristics, even when the polyamide-polyether copolymer having low hydroscopicity is used.


Inventors:
YASUI KEIKO
ITO MASAHIKO
Application Number:
JP2000025926A
Publication Date:
August 10, 2001
Filing Date:
February 03, 2000
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01C7/04; G01K7/16; (IPC1-7): H01C7/04; G01K7/16
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)