Title:
高性能接着剤組成物
Document Type and Number:
Japanese Patent JP5527861
Kind Code:
B2
Abstract:
Thermosetting adhesive compositions formed from an epoxy resin containing nano-sized core-shell particles, one or more thermoplastic toughening agent containing an amine-terminated polyethersulfone, and at least one multi-functional epoxy resin, together with at least one amine curing agent to allow full cure of the adhesive composition up to 400° F. are provided herein. Such compositions are useful for forming adhesive films that can bond composite/metal/honeycomb structures for aerospace including bonding of aircraft leading or trailing edges, acoustic nacelle structures, horizontal and vertical tail, and various other structures, as well as for other high performance industrial applications.
Inventors:
Kori, Dalip
Application Number:
JP2012526982A
Publication Date:
June 25, 2014
Filing Date:
August 26, 2010
Export Citation:
Assignee:
Psytech Technology Corporation
International Classes:
C09J163/00; C08G59/50; C08J5/24; C08K5/17; C08L63/00; C08L81/06; C09J5/06; C09J7/00; C09J11/04; C09J11/06; C09J11/08; C09J109/02; C09J177/00; C09J179/08; C09J181/06
Domestic Patent References:
| JP2007314753A | ||||
| JP2008156486A | ||||
| JP4328117A | ||||
| JP4249524A | ||||
| JP63170411A |
Foreign References:
| US5089560 |
Attorney, Agent or Firm:
Patent business corporation Odashima patent office