To make it possible to form patterns having good resolution by i ray exposure by using a high-polymer compound having a specific structural unit, thereby obtaining the photosensitive resin composition of a negative type or position type which attains the compatibility of good i ray permeability with low expandability and is useful as a material for the surface protective films and interlayer insulating films of semiconductor devices, etc., of low residual stress.

The high-polymer compound having the structural unit expressed by formula is provided. In the formula, Z is the group selected from -O-, -CO-, -Si(CH3)2-, -Si(OCH3)2-, -C(CH3)2-, -C(OCF3)2-, -C(OCH3)(CF3)-, -C(OCH3)2-, -C(OCF3)2- and -C(OCH3)(OCF3)-. and R and R' are respectively independently univalent groups and are the groups capable of constituting a ring together with Z by adding or condensing each other by light or heat. The high-polymer compound in which R and R' are both OH is provided.