Title:
HIGH PRESSURE DIE ASSEMBLED BODY
Document Type and Number:
Japanese Patent JPS5710322
Kind Code:
A
Abstract:
A high pressure die assembly for use in making synthetic diamonds, cubic boron nitride and abrasive compacts which is characterised by the aperture (16) for the die member (12) of the assembly being formed in abrasive compact. Preferably, the leading ends (20) of the anvils (18) which are adapted to move into and out of the aperture (16) are also made of abrasive compact.
Inventors:
HENRII BURUTSUKU DAIYAA
Application Number:
JP5044181A
Publication Date:
January 19, 1982
Filing Date:
April 03, 1981
Export Citation:
Assignee:
DE BEERS IND DIAMOND
International Classes:
B01J3/06; B30B11/00; B30B15/02; (IPC1-7): B01J3/06