Title:
高剛性、多層半導体パッケージ、およびその製造方法
Document Type and Number:
Japanese Patent JP2004507073
Kind Code:
A
Abstract:
The present invention provide a plurality of layered substrates for semiconductor packages. The substrates include, for example, a metal matrix composite layer and at least one carrier layer having a coefficient of thermal expansion and a thermal conductivity greater than the metal matrix composite. In the preferred embodiment, the metal matrix composite includes between approximately 50% to 95% refractory metal with the remainder copper. Suitable carrier layer materials include, for example, copper. So configured, the layered substrates provide improved rigidity and thermal characteristics for matching with ceramic materials.
Inventors:
Kirker, Jeffrey A.
Max, Lee Bee.
Sepulveda, Juan El.
Daral, Killan Kumar H.
Adams, Norbert
Max, Lee Bee.
Sepulveda, Juan El.
Daral, Killan Kumar H.
Adams, Norbert
Application Number:
JP2001575465A
Publication Date:
March 04, 2004
Filing Date:
April 03, 2001
Export Citation:
Assignee:
Brush Wellman,Inc.
International Classes:
C22C29/06; B22F7/06; C22C9/00; C22C14/00; C22C21/00; C22C25/00; C22C27/00; C22C29/12; H01L23/057; H01L23/14; H01L23/367; H01L23/373; (IPC1-7): H01L23/14; B22F7/06; C22C9/00; C22C14/00; C22C21/00; C22C25/00; C22C27/00; C22C29/06; C22C29/12
Attorney, Agent or Firm:
Hidesaku Yamamoto
Takaaki Yasumura
Natsuki Morishita
Takaaki Yasumura
Natsuki Morishita