PURPOSE: To manufacture a high strength conductive Cu alloy suitable for the lead members, etc., of electronic and electrical equipments by adding specified percentages of Sn, P, O2, B, Cr, Zn, etc., to Cu.
CONSTITUTION: An alloy consisting of, by weight, 1W8% Sn, ≤0.08% P, ≤0.0025% O2, 0.01W1% in total of one or more among 0.005W0.1% B, 0.01W1% Al, 0.005W0.5% Si, 0.005W0.2% Ti ad 0.005W0.1% Ca, 0.05W0.5% at least one among Cr, Fe, Co and Ni, 0.01W5% Zn and/or 0.01W0.5% Mn and the balance Cu is manufactured. The Cu alloy has higher strength and conductivity than conventional bronze, undergoes no deterioration in solderability and adhesion to planting with the lapse of time and also has superior resistance to stress corrosion cracking, so the alloy is effectively applicable to the lead and spring members of electronic and electrical equipment.
| JPS5416326 | CONTACT POINT-SPRING COMPOSITE MATERIAL |
TANIGAWA TORU
OOYAMA YOSHIMASA
ASAI MASATO
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