Title:
高強度電解銅箔、それを含む電極、それを含む二次電池およびその製造方法
Document Type and Number:
Japanese Patent JP7287423
Kind Code:
B2
Abstract:
Disclosed herein is an electrolytic copper foil including a copper layer, wherein the copper layer includes a (220) surface, and an orientation index M(220) of the (220) surface is one or more.
Inventors:
Kim Young Tae
Jun San Hyun
Jin Shan Hwa
Ianna
Jun San Hyun
Jin Shan Hwa
Ianna
Application Number:
JP2021145384A
Publication Date:
June 06, 2023
Filing Date:
September 07, 2021
Export Citation:
Assignee:
SK Nexilis Company Limited
International Classes:
C25D1/04; C23C24/08; C25D1/00; H01M4/66
Domestic Patent References:
| JP2011174146A | ||||
| JP2020508399A | ||||
| JP2017517637A | ||||
| JP2006152420A | ||||
| JP4088185A |
Foreign References:
| WO1997043466A1 | ||||
| KR1020110114971A |
Attorney, Agent or Firm:
Satoshi Watanabe