Title:
HIGH-STRENGTH EPOXY ADHESIVE AND USE THEREOF
Document Type and Number:
Japanese Patent JP2011122147
Kind Code:
A
Abstract:
To provide a thermally curable epoxy resin composition exhibiting useful properties.
Disclosed is an epoxy composition which is effective for forming a thermally curable structural adhesive 63, and in particular, a one-part or two-part epoxy resin composition which makes it possible when cured to obtain preferred and improved physical and chemical characteristics useful in structural assembly 60 applications. The epoxy composition includes at least one chain extender, a catalyst, a reactive epoxy resin and a reaction product of polymeric tougheners.
Inventors:
TARBUTTON KENT S
ROBINS JANIS
HORVATH DANIEL J
ROBINS JANIS
HORVATH DANIEL J
Application Number:
JP2010255239A
Publication Date:
June 23, 2011
Filing Date:
November 15, 2010
Export Citation:
Assignee:
THREE M INNOVATIVE PROPERTIES
International Classes:
C08L63/00; C08G59/18; C08G59/40; C08G59/68; C08K5/00; C08L101/00; C08L101/12; C09J5/04; C09J163/00
Domestic Patent References:
| JPH04342720A | 1992-11-30 | |||
| JPH07508307A | 1995-09-14 | |||
| JPH021790A | 1990-01-08 | |||
| JPH01198620A | 1989-08-10 | |||
| JPH04342720A | 1992-11-30 | |||
| JPH07508307A | 1995-09-14 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Yoshihiro Kobayashi
Satoshi Deno
Naoki Kobayashi
Takashi Ishida
Tetsuji Koga
Yoshihiro Kobayashi
Satoshi Deno
Naoki Kobayashi