Title:
HIGH TEMPERATURE ADHESIVE MATERIAL AND BONDING METHOD THEREOF
Document Type and Number:
Japanese Patent JPS5414442
Kind Code:
A
Abstract:
Normally solid heat-activatable thermoplastic adhesives having improved hot tack strength at heat-seal temperatures are composed essentially of copolymers of ethylene with acrylic acid or methacrylic acid having standard melt flow values from about 1 to about 3 dg/min., and are especially useful as heat-seal coating or layer on substrates for packaging.
Inventors:
RICHIYAADO KOOBIN ASURAKUSON
Application Number:
JP7333378A
Publication Date:
February 02, 1979
Filing Date:
June 19, 1978
Export Citation:
Assignee:
DOW CHEMICAL CO
International Classes:
C08F210/00; B05D7/24; C09J123/02; C09J123/08; (IPC1-7): C08F210/02; C09J3/14