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Title:
HIGH TEMPERATURE MODULUS OF ELASTICITY MEASURING APPARATUS AND HIGH TEMPERATURE MODULUS OF ELASTICITY MEASURING METHOD USING IT
Document Type and Number:
Japanese Patent JPH07280780
Kind Code:
A
Abstract:

PURPOSE: To easily measure the modulus of elasticity of metals and ceramics at high temperature by avoiding the heating of a pick-up from a heating part and lowering the damping due to a wire.

CONSTITUTION: A high temperature modulus of elasticity measuring apparatus is composed of a specimen 1 to be measured, a thin wire 2 to hand the specimen 1, a vibration generating part 3 to apply vibration to the specimen 1, a detecting part 4 to detect the vibration signal of the specimen 1, and a heating part 5 to keep the specimen at high temperature and the high temperature modulus of elasticity measuring apparatus is provided with a heat insulating means 6 in the signal detecting part 4 and a high temperature modulus of elasticity measuring method is carried out by utilizing the apparatus.


Inventors:
MAKINO TAKUMA
MITSUSAKI TAGAMI
Application Number:
JP11165194A
Publication Date:
October 27, 1995
Filing Date:
April 13, 1994
Export Citation:
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Assignee:
NGK INSULATORS LTD
International Classes:
G01N29/12; G01N3/00; (IPC1-7): G01N29/12; G01N3/00