Title:
高温シート取扱システムおよび方法
Document Type and Number:
Japanese Patent JP2012507147
Kind Code:
A
Abstract:
Methods and apparatus provide for imparting a controlled supply of gas to at least one Bernoulli chuck to provide a balanced draw and repellant gas flow to a material sheet; and at least one of: elevating a temperature of the supply of gas to the at least one Bernoulli chuck such that the gas flow to the material sheet is provided at the elevated temperature, providing a stream of gas to an insulator substrate to promote separation of an exfoliation layer from a donor semiconductor wafer, and providing a stream of gas to a junction of the insulator substrate and any support structure to promote separation of the insulator substrate and the supporting structure.
Inventors:
Rock, William Yee
Nishimoto, Michael Wye
Nishimoto, Michael Wye
Application Number:
JP2011533289A
Publication Date:
March 22, 2012
Filing Date:
October 21, 2009
Export Citation:
Assignee:
CORNING INCORPORATED
International Classes:
H01L21/02; B65G49/07; H01L21/677; H01L27/12
Attorney, Agent or Firm:
Yanagita Seiji
Go Sakuma
Go Sakuma