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Title:
HIGH VISCOUS FLUID APPLYING APPARATUS
Document Type and Number:
Japanese Patent JP2002239433
Kind Code:
A
Abstract:

To provide a high viscous fluid applying apparatus capable of controlling coating quantity with high precision.

A discharge nozzle 90, a nozzle rotating apparatus 92, a screw pump 94, a screw rotating apparatus 96, an adhesive supply apparatus 98 and the like are provided on a Z axis slide 70 moved in a direction parallel to the surface of a printed wiring board by an X-Y robot. The discharge nozzle 90 is provided coaxially in a pump housing 180, a screw 214 is provided rotatably in a screw chamber 210 and an adhesive is supplied by the adhesive supply apparatus 98. The adhesive filled in the screw chamber 210 without void is fed to the discharge nozzle 90 by a quantity nearly proportional to the rotation angle of the screw 214 on the rotation of the screw 214, and the set quantity of the adhesive is applied on the printed wiring board 16. The applied adhesive is image-picked up by a CCD camera and the rotation angle of a motor 240 for driving screw is corrected corresponding to the excess and the deficiency of the coating quantity.


Inventors:
ISOGAI TAKEYOSHI
KATSUMI YUJI
YAMAZAKI TOSHIHIKO
Application Number:
JP2001001983A
Publication Date:
August 27, 2002
Filing Date:
January 09, 2001
Export Citation:
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Assignee:
FUJI MACHINE MFG
International Classes:
B05C5/00; B05C11/10; F04C11/00; F04C13/00; H05K3/34; (IPC1-7): B05C5/00; B05C11/10
Domestic Patent References:
JPH11276963A1999-10-12
JP2000114283A2000-04-21
JPH10128217A1998-05-19
JPH02100672U1990-08-10
Attorney, Agent or Firm:
Kobe Norikazu