Title:
HIGHLY CONDUCTIVE AQUEOUS INK
Document Type and Number:
Japanese Patent JP2015072914
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a process for forming a conductive pattern on a new substrate.SOLUTION: There is provided a process for forming a conductive pattern on a substrate, which comprises: A) applying an aqueous conductive composition which comprises (a) 6 to 80% of water, (b) 10 to 75% of metal particles having a longest dimension of 100 nm to 50 micrometer or a conductive particulate substance, (c) 2 to 50% of a water-soluble styrene/(meth)acrylic copolymer, (d) 0.01 to 6% of an anionic surfactant and (e) 0.1 to 4% of an antifoaming agent and B) drying the composition, C) wherein the composition when dried has a sheet resistance of 200 milliohm/sq. or less and in a layer having a film thickness of 5 micron or less on a cellulose substrate, the ratio of the surface roughness of the layer to the surface roughness of the substrate is 1.5 or less.
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Inventors:
JASON HADEN ROUSE
DAVE KLEIN
DAVE KLEIN
Application Number:
JP2014222910A
Publication Date:
April 16, 2015
Filing Date:
October 31, 2014
Export Citation:
Assignee:
SUN CHEMICAL CORP
International Classes:
H01B13/00; C09D5/02; C09D5/24; C09D11/037; C09D11/106; C09D125/14; C09D133/00; H01B5/14
Domestic Patent References:
| JPH0977949A | 1997-03-25 | |||
| JP2003142105A | 2003-05-16 |
Foreign References:
| US20030209697A1 | 2003-11-13 |
Attorney, Agent or Firm:
Hisashi Tsuji