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Patent Searching and Data


Title:
HIGHLY EFFICIENT RESONANCE LINE
Document Type and Number:
Japanese Patent JP2008029025
Kind Code:
A
Abstract:

To provide a method and a device for optimizing a dielectric circuit board material for improving performance in a resonance line.

The resonance circuit for processing a radio frequency signal includes a substrate. The substrate is a meta material and can incorporate at least one substrate layer. The resonance line and at least one ground can be connected to the substrate. One end of the resonance line is short-circuited to the ground electrically, or can be opened electrically. A substrate layer can include a first region having substrate characteristics and at least one second region. At least one portion of the resonance line can be connected to the second region. A set of first and/or second substrate characteristics is changed discriminatorily, and permittivity and/or permeability can be changed in a selection region. A set of third substrate characteristics is also given to a third region.


Inventors:
Killen, William Dean
Pike, Randy T.
Application Number:
JP2007000226499
Publication Date:
February 07, 2008
Filing Date:
August 31, 2007
Export Citation:
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Assignee:
HARRIS CORP
International Classes:
H01P3/02; H01P7/08; H01P1/203; H01P1/215; H01P3/08; H01P5/02; H05K1/02; H05K1/16