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Patent Searching and Data


Title:
HIGHLY ELECTRICALLY CONDUCTIVE RESIN COMPOSITION AND ELECTRICALLY CONDUCTIVE RESIN MOLDED PRODUCT THEREFROM
Document Type and Number:
Japanese Patent JPS5765751
Kind Code:
A
Abstract:

PURPOSE: A highly electrically conductive resin composition, prepd. by compounding a resin with an electrically cooductive material formed by coating a core material with a metal having m.p. below the deformation temp. such as softening temp., m.p. or pyrolysis temp. of the core material.

CONSTITUTION: An electrically conductive material formed by coating the surface of a core material such as glass fiber, metal fiber or copper-plated carbon fiber with a metal such as tin, lead, aluminum or solder having m.p. below the deformation temp. of the core material in a thickness about 0.2W100μ, is used. Namely, a resin such as polyethylene or epoxy resin is compound with about 5W60vol%, based on the composition to be prepd., said electrically conductive material to obtain an electrically conductive resin composition.


Inventors:
GASHIRO JIYUNZOU
Application Number:
JP13978980A
Publication Date:
April 21, 1982
Filing Date:
October 08, 1980
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
C08K9/00; C08K9/02; C08L7/00; C08L21/00; C08L23/00; C08L33/00; C08L33/02; C08L51/00; C08L51/02; C08L67/00; C08L77/00; C08L101/00; H01B1/22; (IPC1-7): C08K9/00; C08L101/00; H01B1/22
Domestic Patent References:
JPS5190338A1976-08-07
JPS5490596A1979-07-18
JPS5229842A1977-03-07
JPS51134893A1976-11-22
Foreign References:
US4216423A1980-08-05