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Title:
HIGHLY ELECTROCONDUCTIVE HEAT-EXPANDABLE MICROSPHERE, COMPOSITION THEREOF, AND METHOD FOR MEASURING HEAT-EXPANDABLE MICROSPHERE CONTENT OF THE COMPOSITION
Document Type and Number:
Japanese Patent JP2008195885
Kind Code:
A
Abstract:

To provide heat-expandable microspheres characterized in that even after they are mixed with base materials, the content of the microspheres can be measured.

What are provided are heat-expandable microspheres which are ones having a structure formed by entrapping a blowing agent in a shell made from a polymer and is characterized in that when measured on a water extract obtained by steps 1 and 2: step 1 of dispersing 5g of the heat-expandable microspheres at 25C in 20 g of ion-exchanged water of a pH of 7 and an electric conductivity of 1 to prepare a dispersion and step 2 of shaking the dispersion for 30 min at the same temperature to perform water extraction, the difference between 2 and 1 (wherein 2 is the electric conductivity measured at 25C) is greater than 1 mS/cm, and a composition of the microspheres. Further is provided is a measurement method comprising estimating the content of the heat-expandable microspheres in the composition according to the electric conductivity of the composition.


Inventors:
EJIRI TETSUO
Application Number:
JP2007034703A
Publication Date:
August 28, 2008
Filing Date:
February 15, 2007
Export Citation:
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Assignee:
KUREHA CORP
International Classes:
C09K3/00; G01N27/06
Domestic Patent References:
JP2005103469A2005-04-21
JP2004323854A2004-11-18
JP2005232343A2005-09-02
Foreign References:
WO2006083041A12006-08-10
Attorney, Agent or Firm:
Kaoru Watanabe