Title:
HIGHLY HEAT-CONDUCTIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3458196
Kind Code:
B2
Abstract:
PURPOSE: To obtain the subject compsn. which is useful for many applications where heat dissipation is aimed at, such as for a semiconductor-sealing material.
CONSTITUTION: The resin compsn. (e.g. an epoxy resin compsn.) contains 50-95wt.% aluminum nitride ponder which comprises simple particles having an average particle size (D50) measured by laser diffraction of 4μm or higher and a ratio (S1/S2) of the specific surface area (S1) calculated from D50 to the specific surface area (S2) measured by the BET method of 0.3 or higher.
Inventors:
Yuji Nagai
reliance storm surge
reliance storm surge
Application Number:
JP4451494A
Publication Date:
October 20, 2003
Filing Date:
March 16, 1994
Export Citation:
Assignee:
Toyo Aluminum Co., Ltd.
International Classes:
C08K3/28; C08L101/00; H01L23/29; H01L23/31; H05K1/03; (IPC1-7): C08K3/28; C08L101/00
Domestic Patent References:
| JP474705A | ||||
| JP1182331A |
Attorney, Agent or Firm:
Eiji Saegusa (2 others)
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