Title:
２種以上のフィラーを含む高熱伝導性ポリイミドフィルム
Document Type and Number:
Japanese Patent JP7003276
Kind Code:
B2
Abstract:
The present invention provides a polyimide film comprising a thermally conductive filler and a base film, wherein the thermally conductive filler comprises a first thermally conductive filler having an average diameter of 0.001-20 μm and a second thermally conductive filler having an average diameter of 0.1-20 μm, the first thermally conductive filler is a carbon-based filler or a boron-based filler, the second thermally conductive filler is a metal oxide-based filler, the base film is manufactured through imidization of a polyamic acid formed by a reaction of a dianhydride monomer and a diamine monomer, and the polyimide film has a thickness direction thermal conductivity of 0.5 W/m·K or more and a planar direction thermal conductivity of 2.0 W/m·K or more.
Inventors:
Oh, Jiyun
Cho, Song Il
Li, Kirnam
Choi, John Yuru
Cho, Song Il
Li, Kirnam
Choi, John Yuru
Application Number:
JP2020537735A
Publication Date:
January 20, 2022
Filing Date:
September 27, 2018
Export Citation:
Assignee:
PI Advanced Materials CO., Ltd.
International Classes:
C08L79/08; C08G73/10; C08K3/013; C08K3/04; C08K3/105
Domestic Patent References:
| JP2015076356A | ||||
| JP2004123867A | ||||
| JP2003321554A | ||||
| JP2015003953A | ||||
| JP2015117260A | ||||
| JP2011211190A |
Foreign References:
| WO2010027070A1 | ||||
| WO2016135304A1 |
Attorney, Agent or Firm:
Alga Patent Office, a patent business corporation