Title:
HIGHLY TOUGH PHENOLIC RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JP3408031
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a highly tough phenolic resin molding material excellent in moisture resistance, heat resistance and electrical properties by using a resin comprising a specific phenolic resin as the main component, a acrylonitrile/ butadiene rubber and a filler as 3 components.
SOLUTION: This resin molding material comprises a resin comprising a resol phenolic resin as the main component, an acrylonitrile/butadiene rubber, and a filler as 3 components. A phenolic resin molding material wherein a resin component comprises 20-60 pts.wt. novolak phenolic resin and 100 pts.wt. dimethylene ether resol resin or methylol resol resin is preferable as the resol phenolic resin, and a phenolic resin molding material contg. 70-140 pts.wt. glass fiber is further preferable.
Inventors:
Ama Motoharu
Application Number:
JP25361595A
Publication Date:
May 19, 2003
Filing Date:
September 29, 1995
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08K7/02; C08K7/14; C08L9/02; C08L21/00; C08L61/04; C08L61/06; (IPC1-7): C08L61/06; C08K7/14; C08L9/02
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