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Title:
HINGE DEVICE
Document Type and Number:
Japanese Patent JP2012021575
Kind Code:
A
Abstract:

To reduce diameter of a hinge device by reducing the diameter of an outer diameter of a hinge body.

A small diameter part 2d is formed on an outer peripheral surface of the upper end of a hinge body 2 on which a guide groove 2c is formed. A metal reinforcing cylinder 8 is fitted to the small diameter part 2d.


Inventors:
KOSHIKAWA SHINICHIRO
NIIMI AKIRA
Application Number:
JP2010159336A
Publication Date:
February 02, 2012
Filing Date:
July 14, 2010
Export Citation:
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Assignee:
SUGATSUNE KOGYO
International Classes:
F16C11/04; H04M1/02
Domestic Patent References:
JP2003343543A2003-12-03
JP2006037392A2006-02-09
JP2007271063A2007-10-18
JP2009174557A2009-08-06
JP2009057998A2009-03-19
JP2006183731A2006-07-13
JP2007009714A2007-01-18
Attorney, Agent or Firm:
Noboru Watanabe
Harada Sanjugi



 
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