Title:
HOLDER FOR ELECTROLESS PLATING
Document Type and Number:
Japanese Patent JP3348092
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a holder for electroless plating by which plating can be applied to a board without causing improper appearance even if used in the process from electroless plating to drying and also treatment can be applied to a plurality of boards at one time.
SOLUTION: The holder is used in electroless plating for a flexible printed wiring board and has: a rectangular conductive frame 12 having inside space larger than the external shape of the above board; a conductive auxiliary frame part 14 which is disposed into a bridge-like state between both side parts of the above frame and attached freely slidably along the both side parts; conductive fitting members 16 which are attached to the above frame and the above auxiliary frame part, respectively, and pinch and hold the above board; and conductive extension members 17 which propel the above auxiliary frame part toward the direction in which the above board is extended.
Inventors:
Toshiharu Naka
Masami Ishikawa
Hiroshi Kawasaki
Masami Ishikawa
Hiroshi Kawasaki
Application Number:
JP2001037258A
Publication Date:
November 20, 2002
Filing Date:
February 14, 2001
Export Citation:
Assignee:
Ebara-Udylite Co., Ltd.
International Classes:
C23C18/16; C23C18/31; H05K3/18; (IPC1-7): C23C18/31; H05K3/18
Domestic Patent References:
| JP2002235178A | ||||
| JP10145030A | ||||
| JP5106055A | ||||
| JP5206686A | ||||
| JP410365U | ||||
| JP5126458U | ||||
| JP4114564U | ||||
| JP242065U | ||||
| JP61117278U |
Attorney, Agent or Firm:
Koichi Fujii
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