Title:
HOLDER OF SUBSTRATE FOR PLATING
Document Type and Number:
Japanese Patent JP2015101764
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for clamping even a thin substrate without causing wrinkles, a sag, deformation, and the like.SOLUTION: Following measures are applied to a holder 1 of a substrate for plating. (1) A clamp member 10 comprises: a clamp frame 11 having a mouth of a nearly U shape; and a clamp lever 20 pivoted the frame 11. (2) A distance between an inner side surface of a lower plate part 12 and an inner side surface of an upper plate part 14 of the clamp frame 11 is larger than a thickness of the holder 1 of the substrate to be plated in a state of holding the substrate 2, and the upper plate part 14 of the clamp frame 11 has a passing window for the clamp lever 20. (3) A clamping surface 23 of the clamp lever 20 presses a substrate presser plate 5 in a direction orthogonal to the plate 5.
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Inventors:
KAWASAKI YUJI
Application Number:
JP2013243500A
Publication Date:
June 04, 2015
Filing Date:
November 26, 2013
Export Citation:
Assignee:
OMORI HANGER KOGYO KK
International Classes:
C25D17/08
Domestic Patent References:
| JP2011089164A | 2011-05-06 | |||
| JP2002161398A | 2002-06-04 | |||
| JP2009228077A | 2009-10-08 | |||
| JP2008057024A | 2008-03-13 | |||
| JP2002309399A | 2002-10-23 |
Foreign References:
| US20140251798A1 | 2014-09-11 |
Attorney, Agent or Firm:
Katsushi Nishina
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