Title:
複数の基体の処理のための、複数の基体の収容のための保持装置、処理設備、および、処理方法
Document Type and Number:
Japanese Patent JP7442273
Kind Code:
B2
Abstract:
Holding devices for receiving a plurality of substrates in a substrate treatment system are disclosed. Holding devices comprise a flange, at least one segment that is releasably disposed on the flange, and at least one carrier for receiving one or a plurality of substrates. The flange has connection faces for disposing the at least one segment on the flange. The at least one segment has a segment support structure. The at least one carrier is assembled on the segment support structure.
Inventors:
Harald Repack
Thomas Meltz
Sebastian Vissel
Andreas Luck
Thomas Meltz
Sebastian Vissel
Andreas Luck
Application Number:
JP2019088367A
Publication Date:
March 04, 2024
Filing Date:
May 08, 2019
Export Citation:
Assignee:
Zolayer Gesellschaft Mito Beschlenktel Haftung
International Classes:
H01L21/683; H01L21/673
Domestic Patent References:
| JP2002198413A | ||||
| JP2013168650A | ||||
| JP2011063845A | ||||
| JP2002050678A | ||||
| JP5078830A | ||||
| JP2015534512A | ||||
| JP2018511705A |
Foreign References:
| WO2011013648A1 |
Attorney, Agent or Firm:
Mitsufumi Ezaki
Blacksmith Minoru Sawa
Shinsuke Nakamura
Blacksmith Minoru Sawa
Shinsuke Nakamura