Title:
保持部材、転写部材、チップ基板、転写部材の製造方法及び製造装置、発光基板の製造方法
Document Type and Number:
Japanese Patent JP7269548
Kind Code:
B2
Abstract:
To increase the productivity of a light emitting substrate on which a plurality of micro light emitting diode chips are arranged.SOLUTION: A holding member 30 holding a plurality of two or more types of light emitting diode chips 50, includes a base material 31 and a plurality of protrusion holding portions 32 that are regularly arranged two-dimensionally on one surface of the base material 31 and each hold one light emitting diode chip 50. A protrusion holding portion 32 includes a protrusion structure 33 and an adhesive layer 35 provided at the tip of the protrusion structure 33, and can be compressed and deformed in a direction perpendicular to the plate surface of the base material 31 by the thickness of the light emitting diode chip 50 or more.SELECTED DRAWING: Figure 10
Inventors:
Shuji Kawaguchi
Kenji Masuda
Daisuke Matsuura
Yoshinao Nakada
Kenji Masuda
Daisuke Matsuura
Yoshinao Nakada
Application Number:
JP2019045014A
Publication Date:
May 09, 2023
Filing Date:
March 12, 2019
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H01L33/00; G09F9/00; G09F9/30; G09F9/33; H01L33/48
Domestic Patent References:
| JP10256311A | ||||
| JP2015141369A | ||||
| JP2011158851A | ||||
| JP2018531504A | ||||
| JP2015157348A | ||||
| JP2003332633A |
Foreign References:
| DE102016221281A1 | ||||
| US20160111605 | ||||
| US20170346011 | ||||
| KR1020190010223A |
Attorney, Agent or Firm:
Miyajima Manabu
Yukihiro Hotta
Yasuhiko Takada
Yukihiro Hotta
Yasuhiko Takada