Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HOLE-DIAMETER CORRECTING METHOD AND DEVICE INVOLVING MEASUREMENT
Document Type and Number:
Japanese Patent JP05293707
Kind Code:
A
Abstract:

PURPOSE: To stabilize the dimension of a hole and improve the quality of the hole by measuring the diameter of the hole by an inside diameter measuring device having a double-leaf measuring element after the hole is machined, and automatically adjusting the tool-diameter of a boring-machining tool based on a correction program preliminarily stored in the side of a control device so that the diameter of the hole conforms to the central value of hole tolerance.

CONSTITUTION: After a hole is machined in a work 6, a turntable 5 is rotated, and the work is directed to the side of an inside diameter measuring device 1 for the hole to be automatically measured. The measured results are inputted to a control device 3. The control device calculates the number of strikes of a tool-diameter correcting tool 4 by the difference between the measured values and the central value of tolerance of the hole-diameter based on a preliminarily stored correction program, and indicates the number of strikes to the tool-diameter correcting tool. The tool- diameter correcting tool engages a boring-machining tool 2 to strike the boring- machining tool by the indicated number of strikes, and to automatically correct the diameter of a tool. Thereafter, a next work on the turntable is directed to the boring- machining tool side and positioned. The work is machined by the boring-machining tool, the tool-diameter of which is corrected.


Inventors:
Fukazawa, Hiroyuki
Application Number:
JP1992000121079
Publication Date:
November 09, 1993
Filing Date:
April 16, 1992
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUI SEIKI KOGYO CO LTD
International Classes:
B23B49/00; B23Q15/00; B23Q17/20; B23B49/00; B23Q15/00; B23Q17/20; (IPC1-7): B23B49/00; B23Q15/00; B23Q17/20