Title:
HOLLOW FILLER, RESIN MOLDING AND CLEANER
Document Type and Number:
Japanese Patent JP2012224798
Kind Code:
A
Abstract:
To provide a hollow filler effective for weight reduction and strengthening of a cleaner piping or the like, and to provide a resin molding using the same.
This hollow filler is provided with a hollow member, a first layer laminated on the surface of the hollow member and containing a compound expressed by formula, and a second layer covering the first layer and containing a modified polyolefin bonded to the first layer, where in formula, n is an integer of 0 or more; X is an amino group or epoxy group; and Y is chlorine or -OR (R is hydrogen or an alkyl chain).
Inventors:
KUWABARA KOSUKE
AMO SATORU
FUJITA NOBORU
ISHIDA TAKESHI
NAKANO SEIICHIRO
AMO SATORU
FUJITA NOBORU
ISHIDA TAKESHI
NAKANO SEIICHIRO
Application Number:
JP2011095638A
Publication Date:
November 15, 2012
Filing Date:
April 22, 2011
Export Citation:
Assignee:
HITACHI APPLIANCES INC
International Classes:
C08K7/22; C08J5/00; C08L23/00
Domestic Patent References:
| JP2007517128A | 2007-06-28 | |||
| JP2007182491A | 2007-07-19 | |||
| JPH05139783A | 1993-06-08 | |||
| JPH07232324A | 1995-09-05 | |||
| JP2006241340A | 2006-09-14 |
Attorney, Agent or Firm:
Manabu Inoue
Yuji Toda
Shigemi Iwasaki
Yuji Toda
Shigemi Iwasaki
Previous Patent: METHOD FOR PRODUCING TRANSESTERIFIED FAT-AND-OIL
Next Patent: LIQUID SEALING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME
Next Patent: LIQUID SEALING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME