Title:
HOLLOW SEALING RESIN SHEET AND MANUFACTURING METHOD OF HOLLOW PACKAGE
Document Type and Number:
Japanese Patent JP2015128147
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a hollow sealing resin sheet into which an electronic device may suitably be embedded, and a material composing the sealing resin sheet hardly flows into a gap between an adherend and the electronic device.SOLUTION: A test substrate, containing an inorganic filler having content of equal to or more than 62 vol.%, in a particle size distribution of which particles exceeding a width of a hollow part of a hollow package to be manufactured are less than 10 vol.%, flip-chip-connected to a plurality of chips, is used. After a hollow sealing resin sheet is disposed on the test substrate, when pressure is applied from the hollow sealing resin sheet side at 70°C, with pressure of 1 kgf/cm, at a vacuum degree of 10 Torr, a ration A/B of an entering speed A into gaps between chips of materials composing the hollow sealing resin sheet to an entering speed B into gaps between materials composing the hollow sealing resin sheet is equal to or more than 5.
Inventors:
TOYODA HIDESHI
SHIMIZU YUSAKU
HABU TSUYOSHI
ICHIKAWA TOMOAKI
SHIMIZU YUSAKU
HABU TSUYOSHI
ICHIKAWA TOMOAKI
Application Number:
JP2014216245A
Publication Date:
July 09, 2015
Filing Date:
October 23, 2014
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
H01L23/29; H01L23/02; H01L23/08; H01L23/31; H03H3/08; H03H9/25
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office