HOLLOW STRUCTURE ELEMENT, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS

Title:

HOLLOW STRUCTURE ELEMENT, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS

Document Type and Number:

Japanese Patent JP2005342817

Kind Code:

A

Abstract:

To manufacture a hollow structure element having high durability by preventing the first and secondary stictions.

A structure 2 is provided through a sacrifice layer imbedded in a recessed portion 10a provided on a base plate 10, and a hollow structure element 1 structures a hollow space S in the recessed portion 10a by etching the sacrifice layer. On an inner surface of the recessed portion 10a, a thin film 11 made from material capable of forming a predetermined product by reacting with etchant etching the sacrifice layer is provided. The manufacturing method forms the thin film 11 made from the material capable of forming the predetermined product by reacting with the etchant etching the sacrifice layer on the inner surface of the recessed portion 10a, after forming the recessed portion 10a on the base plate 10, and imbeds the sacrifice layer through the thin film 11.

Inventors:

MITARAI TAKASHI
TANAKA NAOHIRO
TADA MASAHIRO
NANBADA KOJI
AISAKA TSUTOMU

Application Number:

JP2004163053A

Publication Date:

December 15, 2005

Filing Date:

June 01, 2004

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SONY CORP

International Classes:

B81C1/00; H01L41/09; H01L41/18; H01L41/187; H01L41/22; H03H3/02; H03H9/17; (IPC1-7): B81C1/00; H01L41/09; H01L41/18; H01L41/187; H01L41/22; H03H3/02; H03H9/17

Attorney, Agent or Firm:

Funabashi Kuninori

Previous Patent: MACHINING CENTER AND COLUMN SUPPORTING METHOD OF MACHINING CENTER

Next Patent: ONE-LEG SPHERICAL WHEEL MOVING ROBOT