Title:
ハニカムセグメント及びハニカム構造体
Document Type and Number:
Japanese Patent JP5292282
Kind Code:
B2
Abstract:
Formation is performed so that an opening percentage of the first cells 5a may increase continuously or in stages from the first cells 5a in a central portion in the cross section toward the first cells 5a in a peripheral portion excluding incomplete cells in an outermost periphery in the cross section. Specifically, the partition wall between the first cell 5a and the first cell 5a is formed to have a large thickness. In addition, the difference in the opening percentage between the first cell 5a and the second cell 5b is made small. A honeycomb segment and a honeycomb structure of the present invention can inhibit crack generation due to a heat spot generated by the difference of thermal conductivity.
Inventors:
Takashi Mizutani
Application Number:
JP2009508932A
Publication Date:
September 18, 2013
Filing Date:
January 22, 2008
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
B01D39/20; B01D46/00; F01N3/022
Domestic Patent References:
| JP2005270969A | 2005-10-06 | |||
| JP2005125209A | 2005-05-19 | |||
| JP2001334114A | 2001-12-04 | |||
| JP2006281134A | 2006-10-19 | |||
| JP2001206780A | 2001-07-31 |
Foreign References:
| WO2005079165A2 | 2005-09-01 |
Attorney, Agent or Firm:
Ippei Watanabe
Koji Kikawa
Chongqing Sugano
Hiroyuki Sato
Shigeru Koike
Koji Kikawa
Chongqing Sugano
Hiroyuki Sato
Shigeru Koike