Title:
ハニカム構造体及びそのアッセンブリ
Document Type and Number:
Japanese Patent JP4511070
Kind Code:
B2
Abstract:
A honeycomb structure obtained by bonding, into one piece, a plurality of honeycomb segments (2) each having a large number of passages (6) surrounded by cell walls and extending in the axial direction of the segment. In the honeycomb structure, a material A (3) having compressive elasticity (3) is provided at least at a portion of the gaps formed by each two faces of adjacent honeycomb segments (2), close to each other. A honeycomb structure assembly (8) obtained by providing a material B (5) having compressive elasticity on the outer peripheral portion of the above honeycomb structure in a compressed state and thereby compression-holding the honeycomb structure in a metallic container (11). The honeycomb structure and the honeycomb structure assembly have good durability to a heat or a vibration, applied during their use.
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Inventors:
Toshihiko Hijikata
Application Number:
JP2001095014A
Publication Date:
July 28, 2010
Filing Date:
March 29, 2001
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
B01J35/04; B01D39/14; F01N3/02; B01D39/20; B01D46/00; B01D46/24; B01D53/86; B01D53/88; B01D53/94; B01J33/00; F01N3/28; H01M8/06
Domestic Patent References:
| JP2002282634A | ||||
| JP9220480A | ||||
| JP2000210517A | ||||
| JP6047620U | ||||
| JP1063715U | ||||
| JP7127443A |
Attorney, Agent or Firm:
Ippei Watanabe