Title:
ハニカム構造体
Document Type and Number:
Japanese Patent JP5031562
Kind Code:
B2
Abstract:
A honeycomb structure is disclosed that includes plural honeycomb units bonded together by using a sealing material layer, each of the honeycomb units including plural through-holes separated by plural partition walls and provided in parallel along a longitudinal direction. Each of the honeycomb units includes at least ceramic particles, and inorganic fibers and/or whiskers; a cross sectional area of the honeycomb unit is from 5 cm 2 to 50 cm 2 ; and an outer surface of each honeycomb unit and the sealing material layer satisfy: 0.5 ‰¦ º / d × dc / ºc + df / ºf ‰¦ 1 , where, ºf (W/mK) and df (mm) represent a thermal conductivity and a thickness of the outer surface of the honeycomb units, respectively, ºc (W/mK) and dc (mm) represent a thermal conductivity and a thickness of the sealing material layer, respectively, and º (W/mK) and d (mm) represent a thermal conductivity and a thickness of the combination of the outer surface and the sealing material layer.
Inventors:
Kazushige Ohno
Masafumi Kunieda
Kazujo Oku
Masafumi Kunieda
Kazujo Oku
Application Number:
JP2007522178A
Publication Date:
September 19, 2012
Filing Date:
June 24, 2005
Export Citation:
Assignee:
IBIDEN CO.,LTD.
International Classes:
C04B37/00; B01D53/86; B01D53/94; B01J21/04; B01J23/42; B01J32/00; B01J33/00; B01J35/04; F01N3/10; F01N3/28
Domestic Patent References:
| JPH05213681A | 1993-08-24 | |||
| JP2003155908A | 2003-05-30 | |||
| JP2000102709A | 2000-04-11 |
Foreign References:
| WO2004096414A1 | 2004-11-11 | |||
| WO2005000445A1 | 2005-01-06 |
Attorney, Agent or Firm:
Tadahiko Ito