Title:
ハニカム構造体
Document Type and Number:
Japanese Patent JP5469337
Kind Code:
B2
Abstract:
In a honeycomb structure 1 which is made of a ceramic and in which a plurality of honeycomb segments 12 having cell structures 5 and porous outer walls 7 on outer peripheries of the cell structures 5 are integrated by bonding these outer walls 7 to one another with a bonding material 8, each of the cell structures being provided with a plurality of cells 3 constituting fluid channels divided by porous partition walls 2, a base material constituting the honeycomb structure 1 has a thermal conductivity of 0.1 to 20 W/mK. Moreover, an outer periphery coating material constituting the outer peripheral wall of the honeycomb structure 1 has a porosity of 10 to 60%. Furthermore, the outer periphery coating material constituting the outer peripheral wall of the honeycomb structure 1 has a thermal conductivity of 0.01 to 0.5 W/mK.
Inventors:
Atsushi Watanabe
Nao Masukawa
Shuichi Ichikawa
Nao Masukawa
Shuichi Ichikawa
Application Number:
JP2008513093A
Publication Date:
April 16, 2014
Filing Date:
February 15, 2007
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
C04B41/85; B01D39/20; B01D53/86; B01D53/94; B01J32/00; B01J35/04; B28B11/04; C04B37/00; F01N3/021
Domestic Patent References:
| JP2002273137A | 2002-09-24 | |||
| JP2005199179A | 2005-07-28 | |||
| JP2005324092A | 2005-11-24 | |||
| JPH05269388A | 1993-10-19 | |||
| JP2004051384A | 2004-02-19 |
Foreign References:
| WO2005089901A1 | 2005-09-29 | |||
| WO2005089901A1 | 2005-09-29 | |||
| WO2006001509A1 | 2006-01-05 |
Attorney, Agent or Firm:
Ippei Watanabe