Title:
ハニカム構造体
Document Type and Number:
Japanese Patent JP6389045
Kind Code:
B2
Abstract:
There is provided a honeycomb structure where a crack at a honeycomb substrate is reduced. A honeycomb structure 100 has a honeycomb substrate 10 that has a porous partition wall 1 defining a plurality of cells 2 extending from an inflow end face 11 as one end face to an outflow end face 12 as another end face and becoming channels for a fluid, and an outer circumference coating layer 26 disposed at an outer circumference of the honeycomb substrate 10. At 25 to 800°C, a thermal expansion coefficient of the outer circumference coating layer 26 is larger than a thermal expansion coefficient of the honeycomb substrate 10. The thermal expansion coefficients of the outer circumference coating layer 26 and the honeycomb substrate 10 at 25 to 800°C preferably meet a relationship represented by the expression: 1.1 < (the thermal expansion coefficient of the outer circumference coating layer 26/the thermal expansion coefficient of the honeycomb substrate 10) < 40.
Inventors:
Mitsuhiro Ito
Application Number:
JP2014041375A
Publication Date:
September 12, 2018
Filing Date:
March 04, 2014
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
C04B41/85; B01D39/20; B01D46/00; F01N3/022
Domestic Patent References:
| JP2010001204A | ||||
| JP2001261428A | ||||
| JP2004001365A | ||||
| JP2010012416A | ||||
| JP6173669A | ||||
| JP2015166573A | ||||
| JP63246414A | ||||
| JP2012215102A |
Foreign References:
| WO2008114636A1 | ||||
| WO2009014200A1 | ||||
| WO2008126485A1 |
Attorney, Agent or Firm:
Ippei Watanabe
Koji Kikawa
Hiroyuki Sato
Shigeru Koike
Koji Kikawa
Hiroyuki Sato
Shigeru Koike