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Title:
HOOP MATERIAL FOR BI-METAL, MANUFACTURING METHOD OF BI-METALLIC ELEMENT USING THE SAME AND TEMPERATURE BREAKER
Document Type and Number:
Japanese Patent JP2013137996
Kind Code:
A
Abstract:

To provide a hoop material for bi-metals that is improved such that deformation or the like of snap elements formed at central portions of the bi-metals does not occur when individual pieces of the bi-metals are cut off from carrier portions and so as to be able to correspond to a reduction in size and to facilitate precision processing.

In a hoop material 10 for bi-metals for continuously disposing individual pieces of the bi-metals having dome-like snap elements 12a formed at a substantially central portion of a coil material formed of a long band-like bi-metal plate wound, each bi-metal element 12 has the dome-like snap element 12a provided on the bi-metal and a tabular or gently curved surface-like frame portion 12b surrounding an outer edge of the snap element 12a. Each bi-metal element 12 is configured so as to be connected to a carrier portion 11 of the hoop material 10 via a tie bar portion 13 provided at a corner and to bring a contact surface of a cutting blade into contact with an in-plane only widened from the corner of the frame portion 12b to the outer edge of the snap element 12a. Each bi-metal element 12 is further configured, when the individual pieces of the bi-metals are cut off from the carrier portions 11, so as to cause a cutting tool not to be brought into contact with the snap element 12a of the bi-metal and to prevent deformation and a defect.


Inventors:
WAKABAYASHI TAMOTSU
HATTORI TSUYOSHI
MURATA KATSUYUKI
Application Number:
JP2012258067A
Publication Date:
July 11, 2013
Filing Date:
November 27, 2012
Export Citation:
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Assignee:
NEC SCHOTT COMPONENTS CORP
International Classes:
H01H37/52; B21D22/20; B21D28/00; B21D53/00; B30B13/00
Domestic Patent References:
JP2005243626A2005-09-08
JP2011198645A2011-10-06
JP2003187664A2003-07-04
JPH0214534A1990-01-18
JP2001210172A2001-08-03