PURPOSE: To execute horn removal of dip soldering within a stage of a dipping treatment without using a heater.

CONSTITUTION: This horn remover for dip soldering is disposed with a mask 12 for preventing solder splashing at the top end of a molten solder tank 11. An insertion hole 13 for dipping the terminal 23 of electronic parts 15 into molten solder is formed at a mask 12. The mask 12 is formed with an aperture 26 adjacently to this insertion hole 13. The insertion hole 13 and the aperture 26 are arranged in the lower position of a moving route for the dipping treatment of the terminal 23 of the electronic parts 15. One end of a leaf spring 27 is fixed near to the aperture 26 and the other end of this leaf spring 27 is bent into the aperture 26 when force from above acts on the leaf spring 27.