Title:
Hot Stamping molding public-funds type
Document Type and Number:
Japanese Patent JP6010328
Kind Code:
B2
Abstract:
A mold for hot stamping is disclosed. The mold may include: a base plate configured to receive and exhaust coolant; at least one appearance block mounted at a surface of the base plate and positioned along a shape of a product, the appearance block having a mounting space therein; and an insert block inserted in the mounting space so as to be fixed to the appearance block and mounted at a surface of the base plate. The insert block is provided with a plurality of passages in an exterior surface thereof for circulating coolant, wherein the plurality of passages are in fluidly communication with the base plate.
Inventors:
Minister Lee
Application Number:
JP2012094742A
Publication Date:
October 19, 2016
Filing Date:
April 18, 2012
Export Citation:
Assignee:
HYUNDAI MOTOR COMPANY
International Classes:
B21D24/00; B21D37/16
Domestic Patent References:
| JP2009543697A | ||||
| JP2005007442A |
Foreign References:
| US8047037 | ||||
| US20060059971 | ||||
| EP1749593A2 |
Attorney, Agent or Firm:
Kyosei International Patent Office