Title:
HOT AIR LEVELER APPARATUS
Document Type and Number:
Japanese Patent JP3237407
Kind Code:
B2
Abstract:
PURPOSE: To uniformly apply solder to a printed wiring board, without causing the deflecting or chattering even if the thickness of the wiring board is small.
CONSTITUTION: A hot air leveler apparatus for applying solder to a printed wiring board by dipping it in a solder bath tank comprises a guide roll assembly 3 composed of guide rolls 1 mounted on a rotary shaft 2 and air knives 4, all disposed on the upper side of the tank 5.
Inventors:
Koji Sato
Aoyama Tokumi
Aoyama Tokumi
Application Number:
JP17253194A
Publication Date:
December 10, 2001
Filing Date:
July 25, 1994
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
H05K3/24; C23C2/16; H05K3/34; (IPC1-7): H05K3/24; C23C2/16; H05K3/34
Domestic Patent References:
| JP2194690A | ||||
| JP372062A | ||||
| JP62280109A | ||||
| JP3280489A |
Attorney, Agent or Firm:
Junji Ando (1 person outside)