To provide a hot-air nozzle for brazing electronic component mounted on wiring board that can braze an electronic component to a circuit pattern formed on a wiring board in a defectless state, without being adversely affected by electronic components existing in the vicinity of the brazing point, nor exerting any adverse effect on the electronic components with hot air at the time of connecting the electronic component to the circuit pattern by brazing by melting a bonding metal with the nozzle.

This hot-air nozzle has a hot-air blowing-out nozzle port 10 which connects the electronic component 5 to the wiring board 4 by melting the bonding metal 7 charged in the terminal connection of the electronic component 5 mounted on the wiring board 4, by blowing out the hot air 8 against the metal 7, and a hot-air sucking nozzle port 11 which sucks in the hot air 8 blown out upon the charged bonding metal 7 from the port 10 and hits the metal 7 in the circumference of the port 10.