To obtain the subject adhesive suitable for bonding a hinge to a body of an automobile, in a solid state at a room temperature, rapidly made into a paste at a temperature equal to or higher than an operation temperature, then gradually reducing a viscosity, comprising a liquid epoxy resin and a specific polymer, by decreasing reduction ratio of torque in electrodeposition and baking.

This hot application type adhesive comprises (A) a liquid epoxy resin and (B) a crystalline polymer (e.g. an aromatic or an aliphatic polyester having 9-11 SP value) having compatibility with the component A and has <10% reduction ratio of release torque under electrodeposition and baking condition. The adhesive, for example, is composed of 100 pts.wt. of the component A, 20-80 pts.wt. of a crystalline polycaprolactone having 8,000-60,000 number-average molecular weight as the component B, 1-30 pts.wt. of a heat activation type epoxy resin curing agent such as dicyandiamide and optionally 0-50 pts.wt. of an inorganic filler.