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Patent Searching and Data


Title:
HOT MELT ADHESIVE BASED ON ETHYLENE TERPOLYMER AND METHOD OF BONDING BY USING THE SAME
Document Type and Number:
Japanese Patent JPH04227982
Kind Code:
A
Abstract:

PURPOSE: To obtain a heat-stable hot melt adhesive which can be used for bonding various adherends by mixing a specified ethylene terpolymer with a tackifier.

CONSTITUTION: A hot melt adhesive composition which is a molten liquid at a service temperature and comprises an ethylene terpolymer comprising about 40-87wt.% ethylene, about 5-50wt.% second monomer selected between an alkyl acrylate and an alkyl vinyl ether (wherein the alkyl has 1-8C atoms) and about 3-30wt.% third monomer selected between carbon monoxide and sulfur dioxide (based on the weight of the terpolymer), about 5-80wt.% compatible tackifier (based on the total weight of the terpolymer and the tackifier) and 0-30wt. % compatible plasticizer (about 4wt.% or below when the second monomer is present in an amount of 10wt.% or below).


Inventors:
AANESUTO FURANSHISU IISUTOMAN
EDOWAADO MATSUKU BURAIDO
ROBAATO JIYOSEFU SUTATSUTSU
Application Number:
JP11314791A
Publication Date:
August 18, 1992
Filing Date:
May 17, 1991
Export Citation:
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Assignee:
MITSUI DU PONT POLYCHEMICAL
International Classes:
C09J123/08; C09J123/02; (IPC1-7): C09J123/08
Attorney, Agent or Firm:
Shunichiro Suzuki