Title:
HOT MELT ADHESIVE BASED ON POLYARYLENE ETHER KETONE AND ITS USE
Document Type and Number:
Japanese Patent JPH04270777
Kind Code:
A
Abstract:
PURPOSE: To provide a hot melt adhesive which realizes adhesive bonds resistant to high temperature in composites composed of metallic, ceramic and/or polymer substrates which have very good shear strengths by including a specified polyarylene ether ketone as a base material.
CONSTITUTION: This hot melt adhesive is based on a polyarylene ether ketone represented by formula -[O-Ar(-L-Ar)x-O-Ar-Co-(-Ar-M)y-Ar-] (wherein Ar represents phenylene, biphenyl or naphthylene; L and M represent -O- or -CO-; and x and y are an integer of 0 to 4), wherein the ether to ketone ratio is between 0.5 and 2 (pref. 0.66 to 1) and the melt flowability (MVI400/10 min) is 2 to 250 (pref. 2 to 100).
Inventors:
ANDOREEASU RIYUKE
Application Number:
JP23289391A
Publication Date:
September 28, 1992
Filing Date:
September 12, 1991
Export Citation:
Assignee:
HOECHST AG
International Classes:
C08J5/12; C08G65/40; C09J171/00; C09J171/10; C09J171/12; (IPC1-7): C08J5/12; C09J171/12
Attorney, Agent or Firm:
Chika Takagi (2 outside)
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