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Patent Searching and Data


Title:
HOT MELT ADHESIVE COMPOSITION AND ITS APPLICATION
Document Type and Number:
Japanese Patent JPH026580
Kind Code:
A
Abstract:

PURPOSE: To provide hot melt adhesive which has good low-temperature flexibility, and good adhesiveness to cable base material, by mixing specified alkyl terpolymer ethylene/acrylate and specified alkyl copolymer ethylene/acrylate.

CONSTITUTION: An adhesive composition is mixture of (a) 25-40 pts.wt. of alkyl terpolymer ethylene/acrylate which has a melt flow index more than 40, which is measured following ASTM D1238-70, and contains maleic acid anhydride and (b) 25-70 pts.wt. of alkyl copolymer ethylene/acrylate which has a melt flow index more than 40, which is measured following ASTM D1238-70. As the terpolymer (a), terpolymer of ethylene, ethyl acrylate and/or butyl acrylate, and maleic acid anhydride is preferably used. As the copolymer (b), copolymer of ethylene, and ethyl acrylate and/or butyl acrylate is preferably used.


Inventors:
NOERU MAASERU MITSUCHIERU OOBA
Application Number:
JP4840789A
Publication Date:
January 10, 1990
Filing Date:
February 27, 1989
Export Citation:
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Assignee:
RAYCHEM SA NV
International Classes:
B29C61/06; C08L23/08; C09J7/00; C08L33/08; C08L35/02; C09J5/06; C09J7/02; C09J123/02; C09J123/08; (IPC1-7): C09J7/00; C09J123/08
Attorney, Agent or Firm:
Aoyama Ryo (1 person outside)