Title:
HOT-MELT ADHESIVE COMPOSITION AND LAMINATE
Document Type and Number:
Japanese Patent JP2018135422
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive hot-melt adhesive composition that can bond adherends together strongly with high conductivity expressed.SOLUTION: A hot-melt adhesive composition contains a thermoplastic resin and a conductive filler. The hot-melt adhesive composition has a volume resistivity value of less than 1000 Ωcm. The thermoplastic resin has 190°C melt viscosity of 1 Pa s or more and 1000 Pa s or less.SELECTED DRAWING: Figure 1
Inventors:
MIZUNO KOTARO
HIROSHIMA TSUTOMU
YOSHIKAWA TAKESHI
HIROSHIMA TSUTOMU
YOSHIKAWA TAKESHI
Application Number:
JP2017029635A
Publication Date:
August 30, 2018
Filing Date:
February 21, 2017
Export Citation:
Assignee:
TOYO INK SC HOLDINGS CO LTD
International Classes:
B32B13/12; C09J201/00; C09J5/06; C09J7/20; C09J9/02; C09J11/04; C09J167/00; C09J177/00
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Foreign References:
| EP3236479A1 | 2017-10-25 |